Concept 2 Market

Equipment List

MyData MY-12E

Based on a single platform, MY-Series machines combine feeder capacity and speed with the ability to place any component - fine-pitch, BGAs, QFPs, chip scale BGAs, CSPs, flip chips and 0201s. So whether you're building prototypes or running high-volume, in-line production, MYDATA machines can answer virtually all your placement needs.

Automated Optical Inspection

Samsung / Mirtec automated optical inspection systems enable C2M to effectively scan each assembly for polarity, correct part placement location, solder shorts, missing components and overall solder condition in a fraction of the time that is required by inspection technicians. The multi angle viewing capability enables a 360 degree inspection of each component for a 100% component inspection.

X-Ray Inspection

Glenbrook Technologies 80 kV real time X-Ray platform ensures accurate verification of solder joint under BGA, uBGA, leadless chip packages, and various other component.

Convection Oven/Solder Reflow

Vitronics SMT oven with 5 programmable heat zones, cupled with a KIC real time oven profilometer; ensure consistent reflowed solder on all boards.

Dual Wave solder capabilities include static and dancer solder pots for maximum wave solder proficiency.

Chip Shooter

Amistar Chip shooter provides a high speed alternative for larger SMT part sizes.

MPM Ultra Print 1500

The MPM solder paste printer is a vision assisted unit that ensures best possible paste registration while also providing a uniform paste thickness on every pass.